Destaticizing thermoplastic resin composition

A destaticizing resin composition comprising:

• (A) 100 parts by weight of a thermoplastic resin;
• (B') 1 to 30 parts by weight of a carbon fiber having a diameter of 1 nm to 1 .mu.m, a length of 1 .mu.m to 10 mm and a volume resistivity of less than 1 .OMEGA.cm;
• and
• (C) 1 to 100 parts by weight of a fibrous conductive filler having a volume resistivity of 100 .OMEGA.cm or less.

A destaticizing resin composition comprising:

• (A) 100 parts by weight of a thermoplastic resin;
• (B) 0.01 to 150 parts by weight of a polymer having a surface resistivity measured at 500 V of 10.sup.8 to 10.sup.11 .OMEGA., a melting point of 100.degree. C. or higher, an apparent melt viscosity at an apparent shear rate at 260.degree. C. of 1,000 sec.sup.-1 of 10 to 1,000 Pa.multidot.s, and a ratio of the above apparent melt viscosity to the apparent melt viscosity of the thermoplastic resin at an apparent shear rate at 260.degree. C. of 1,000 sec.sup.-1 of 0.01 to 1.3;
• and
• (B') 0.01 to 28 parts by weight of a carbon fiber having a diameter of 1 nm to 1 .mu.m, a length of 1 .mu.m to 10 mm and a volume resistivity of less than 1 .OMEGA.cm;
• and
• (C) 1 to 100 parts by weight of a fibrous conductive filler having a volume resistivity of 100 .OMEGA.cm or less,
• wherein the polymer (B) is at least one polymer selected from the group consisting of polyethylene glycol polyamide copolymers, polyethylene glycol methacrylate copolymers, poly(ethylene oxide/propylene oxide) copolymers, polyethylene glycol polyesteramide copolymers, polyethylene glycol polyester elastomers, poly(epichlorohydrin/ethylene oxide) copolymers and polyetheresteramides derived from ethylene oxide adduct of a bisphenol with a polyamide having a carboxyl group at both terminals.