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US 6,150,435 AGranted
One-component epoxy resin for covering electronic components
AssigneeSiemens Aktiengesellschaft
InventorsHeiner Bayer, Barbara Lehner, Ernst Wipfelder
Life of this patent
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Abstract
A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.
Claims12
A one-component epoxy resin comprising:
- A) 10-30 weight % of a first polyol component comprising a hydroxy-functional pre-reacted compound, the first polyol component having a first molecular weight;
- B) 10-60 weight % of a second polyol component having a second molecular weight that is less than the first molecular weight;
- C) 5-90 weight % of an epoxide;
- D) 0-90 weight % of a filler;
- and
- E) an initiator in an amount of 0.01 to 5 weight %, the initiator comprising a first component and a second component, the first component being UV reactive and the second component being thermally reactive.
3 more elements
A one-component epoxy resin comprising:
- A) 10-20 weight % of a first polyol component comprising a hydroxy-functional pre-reacted compound the first polyol component having a first molecular weight;
- B) 10-40 weight % of a second polyol component, having a second molecular weight that is less than the first molecular weight;
- C) 30-70 weight % of an epoxide;
- D) 30-70 weight % of a filler;
- and
- E) an initiator in an amount of 1-3 weight %, the initiator comprising a first component and a second component, the first component being UV reactive and the second component being thermally reactive.
3 more elements
Dependencies are inferred from the claim text.