Method for wiring of a semiconductor device

A method for wiring a semiconductor device having regions to be connected, each of which being made of semiconducting substance or conductive substance, being provided independently, and wirings each of which being connected electrically to each of the regions to be connected,

• characterized in that, each of the wirings comprises contact portions and interconnecting portions having narrower width than that of the contact portions, the interconnecting portions connecting the contact portions mutually, and wherein each of the wirings is formed so as to connect to the regions to be connected electrically at the contact portions, and the contact portions of one of the wirings are provided so as to position adjacently to the interconnecting portions of the wirings provided adjacently to one of the wirings, and wherein a first region to be connected is formed in a shape having comb teeth, and wherein a first wiring and the first region to be connected are connected electrically at the teeth portion of the comb teeth of the first region to be connected, and wherein a second wiring and a second region to be connected are connected electrically at a portion between the comb teeth of the first region to be connected or through a portion between the comb teeth, and wherein the contact portions of the first wiring and the contact portions of the second wiring are provided with one another being substantially in a straight line.