Method and apparatus for singulating semiconductor devices
AssigneeMotorola, Inc.
InventorsMinju Lee, Kilho Cho
Life of this patent
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Abstract
Method and apparatus for singulating semiconductor devices (21) is provided. This approach eliminates the need for an adhesive tape. A fixture (10) is provided to hold the joined semiconductor devices. The fixture has grooves (14 and 18) to accommodate a saw blade (35). The saw makes a cut in two directions thereby separating or singulating the semiconductor devices. Bars (24) are placed across the semiconductor devices when sawing in the second direction to hold the semiconductor devices in the holding fixture. A pick and place machine can then be used to remove the singulated semiconductor devices from the holding fixture.
Claims4
A method for singulating a plurality of integrally joined semiconductor devices that are on a substrate, comprising the steps of:
- placing the substrate having the plurality of integrally joined semiconductor devices arranged in rows and columns into a holding fixture having slots at corners of the holding fixture;
- sliding the substrate into the slots of the holding fixture;
- holding one of the corners of the holding fixture in place with a right angle stop;
- sawing through the substrate in a first direction;
- rotating the holding fixture ninety degrees;
- placing a bar across each of the rows of the plurality of integrally joined semiconductor devices in a direction perpendicular to the first direction;
- sawing through the substrate in a direction equal to the direction of the bar in order to provide singulated semiconductor devices;
- and
- removing the singulated semiconductor devices from the holding fixture with a pick and place machine.
Dependencies are inferred from the claim text.