US 6,150,074 A · Method of forming electrically conductive wiring pattern

Abstract

There is provided a method of forming an electrically conductive wiring pattern, including the steps of patterning a resist on a substrate so that the resist has at least one recess where an electrically conductive wiring is to be formed, the substrate appearing in the recess, the resist being composed of silicon dioxide particles having a diameter of 5 .mu.m or smaller and epoxy acrylate having a fluorene skeleton, etching the resist by plasma-ashing so that the silicon dioxide particles appear on a surface of the resist, forming a metal film over both the resist and the substrate appearing in the recess, and removing the metal film formed on the resist by removing the silicon dioxide particles appearing on a surface of the resist. The above-mentioned method provides a fine, highly accurate, electrically conductive wiring pattern without wiring disconnection and short-circuit

Claims44

Dependent claims

A method of forming an electrically conductive wiring pattern, comprising the steps in sequence of:

(a) patterning a resist containing etch resistant particles therein on a substrate so that said resist has at least one recess where an electrically conductive wiring is to be formed, said substrate appearing in said recess;
(b) etching said resist so as to remove a portion of said resist whereby to expose etch resistant particles on a surface of said resist while leaving another portion of said resist and said etch resistant particles on said substrate;
(c) forming a metal film to a thickness of the height of said recess over both said another portion of said resist and said substrate appearing in said recess;
and
(d) removing said metal film formed on said resist together with said exposed etch resistant particles.

2 more elements

A method of forming a multi-layered wiring structure, comprising the steps in sequence of:

(a) patterning a resist containing etch resistant particles therein on a substrate so that said resist has at least one recess where an electrically conductive wiring is to be formed, said substrate appearing in said recess;
(b) etching said resist so as to remove a portion of said resist whereby to expose etch resistant particles on a surface of said resist while leaving another portion of said resist and said etch resistant particles on said substrate;
(c) forming a metal film to a thickness of the height of said recess over both said another portion of said resist and said substrate appearing in said recess;
(d) removing said metal film formed on said resist together with said exposed etch resistant particles;
(e) forming an interlayer insulating film over the product of said step (d);
(f) forming a via-hole leading to said metal film formed over said substrate appearing in said recess;
(g) patterning a resist containing etch resistant particles therein on the product of said step (f) so that said resist has at lease one recess where an electrically conductive wiring is to be formed, said product of said step (f) appearing in said recess;
(h) repeating steps (b) to (g) a desired number of times;
and
(i) repeating steps (b) to (d).

7 more elements

Dependencies are inferred from the claim text.

Method of forming electrically conductive wiring pattern

Life of this patent

Method of forming electrically conductive wiring pattern

Life of this patent

Abstract

Claims44