Fabrication process for flex circuit applications
Assignee3M Innovative Properties Company
InventorsPaul M. Harvey, William V. Dower, William V. Ballard
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Abstract
The invention provides a process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of providing an input material with two major surfaces, including a dielectric substrate and at least one conductive base layer, laminating a photoresist with a cover sheet onto at least one major surface of the input material, and printing an image onto the cover sheet or removing the coversheet and printing the image onto the photoresist directly.
Claims16
A process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of:
- (a) providing an input material including a dielectric substrate and at least one conductive base layer, said input material having two major surfaces,
- (b) laminating a photoresist having a cover sheet fixedly attached thereover onto at least one major surface of said input material, and
- (c) printing a mask pattern onto said cover sheet, wherein said mask pattern defines the design of the resulting circuit.
A process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of:
- (a) providing an input material including a dielectric substrate and at least one conductive base layer, said input material having two major surfaces,
- (b) laminating a photoresist onto at least one major surface of said input material, said photoresist having a cover sheet thereover,
- (c) removing said cover sheet, and
- (d) printing a mask pattern onto directly onto said photoresist,
- wherein said mask pattern defines the design of the resulting circuit.
Dependencies are inferred from the claim text.