US 6,150,034 A · Buffer layers on rolled nickel or copper as superconductor substrates

Abstract

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y.sub.2 O.sub.3 /Ni, YSZ/Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Ni, Yb.sub.2 O.sub.3 /CeO.sub.2 /Ni, RE.sub.2 O.sub.3 /Ni (RE=Rare Earth), and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Ni, Y.sub.2 O.sub.3 /Cu, YSZ/Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /Y.sub.2 O.sub.3 /Cu, Yb.sub.2 O.sub.3 /CeO.sub.2 /Cu, RE.sub.2 O.sub.3 /Cu, and Yb.sub.2 O.sub.3 /YSZ/CeO.sub.2 /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approach, which includes chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

Claims4

Dependent claims

A biaxially textured article comprising:

(A) a substrate comprising at least one metal selected from the group consisting of Ni and Cu, the substrate having a surface exhibiting biaxial texture;
and
(B) a buffer layer selected from the group consisting of Y.sub.2 O.sub.3 and Yb.sub.2 O.sub.3, the buffer layer being epitaxially disposed upon the biaxially-textured surface of the substrate.

Dependencies are inferred from the claim text.

Buffer layers on rolled nickel or copper as superconductor substrates

Life of this patent

Buffer layers on rolled nickel or copper as superconductor substrates

Life of this patent

Abstract

Claims4