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US 6,150,013 AGranted
Low thermal conductivity in-mold label films
AssigneeAvery Dennison Corporation
InventorsRamabhadran Balaji, Mark E. Polasky
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AssigneeAvery Dennison Corporation
InventorsRamabhadran Balaji, Mark E. Polasky
Estimating the term…
The invention is an in-mold label film comprising at least two layers with one layer being a heat seal layer for bonding the film to a polymer substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-Cal/sec cm .degree. C. The invention further includes a process for in-mold labeling comprising the steps of forming a label comprising at least two layers with one layer being a heat seal layer for bonding the film to a plastic substrate wherein the film has a thermal conductivity of less than about 1.250.times.10.sup.-4 k-cal/sec cm .degree. C. inserting the label into a mold for producing the plastic substrate with a inside and outside surface thereafter forming a plastic substrate in the mold with sufficient heat wherein the outside surface of the substrate bonds with the heat seal layer of the label.
An in-mold label film comprising
An in-mold label film comprising
An in-mold label film comprising:
An in-mold labeling film comprising a heat seal layer, a print layer and a core comprising a voided, uniaxially or biaxially oriented layer between the heat seal layer and the print layer, wherein said voided layer comprises non-spherical void initiating particles and wherein said heat seal layer is activatable at a temperature between 57.degree. and about 100.degree. C., the film having a thermal conductivity of less than about 1.25.times.10.sup.-4 k-Cal/sec cm .degree. C.
Dependencies are inferred from the claim text.