Composition and process for forming electrically insulating thin films
AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsAkihiko Kobayashi, Katsutoshi Mine, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa
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AssigneeDow Corning Toray Silicone Co., Ltd.
InventorsAkihiko Kobayashi, Katsutoshi Mine, Takashi Nakamura, Motoshi Sasaki, Kiyotaka Sawa
Estimating the term…
To provide a composition and process for forming insulating films that can produce insulating films having low dielectric constants. The composition comprises (A) an electrically insulating curable inorganic or organic resin, (B) a solvent, and (C) at least one solvent-soluble substance (excluding the solvent used for component (B)) that upon heating or by interaction with the resin (A) can generate gas or undergo volatilization in the temperature range from 0.degree. C. to 800.degree. C. The insulating films are prepared by coating the surface of a substrate the composition; evaporating the solvent; and subsequently heating the substrate in order to generate gas from component (C) during the course of or after the cure of the said resin (A).
A composition for forming electrically insulating thin films comprising
A process for forming electrically insulating thin films comprising
A process for forming electrically insulating thin films comprising
Dependencies are inferred from the claim text.