A polymer blend composition, capable of being made electrically conductive by application of heat thereto, comprising an electrically conductive upon doping, polymer in undoped form, wherein said undoped polymer is selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polyselenophenes, polyacetylenes formed from soluble precursors and combinations and blends thereof, compounded and blended of a molecular scale with a dielectric polymer, wherein said dielectric polymer is selected from the group consisting of interpolymers of acrylonitrile-butadiene-styrene, acetal acrylic liquid crystal polymers, polybutylene terephthalate, polycarbonate, polyester, polyetherimide, polyethersulfone, polyethylene, polyethylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polypropylene, polystyrene, polyurethane, polyvinylchloride, styrene-acrylonitrile copolymer, fluoropolymers, nylon polyesters, and thermoplastic elastomers, and a thermally deblockable dopant selected from the group consisting of triflates, tosylates and borates, said electrically, upon doping, polymer having conductive enhanced solubility in undoped form with said dielectric polymer to form a compatible molecularly mixed blend in solution and doping of said undoped polymer to reader of conduction occurring only after exposure to heat.