Process and apparatus for the selective electroplating of electrical contact elements

Apparatus for the selective electroplating of electrical contact elements to coat at least one contact surface of a metal base for the contact elements with an electrolyte containing a material with higher conductivity as compared to the base, the apparatus comprising:

• (a) an elongated electroplating tip made of plastic for applying the electrolyte, said tip having a plurality of channel passages for the electrolyte to pass through defined therein, wherein the plurality of channel passages terminates at and empties into at least one discharge opening which extends along the entire length of the tip;
• (b) said electroplating tip, in the operating position, being arranged such that the at least one discharge opening is positioned horizontally on the bottom whereas the passages extend from the at least one discharge opening upward;
• (c) means for supplying the electrolyte to the electroplating tip from above;
• and
• (d) means for moving the base at the lower end of the electroplating tip parallel to said tip such that the region intended for the contact surface of said base is positioned at a uniform distance from and at the level of the at least one discharge opening.