A film forming apparatus for use in a semiconductor manufacturing process including a chamber in which a carbon compound film is formed on a substrate to be processed, wherein the chamber at least includes:
- a holder section comprising an electrostatic chuck operably connected to a first power source, for holding the substrate thereon;
- and
- reactive gas supplying means for supplying a predetermined type of reactive gas into the chamber, and
- a peripheral electrode in constant contact with a peripheral portion of said electrostatic chuck and operably connected to a second power source different from said first power source.