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US 6,149,727 AGranted
Substrate processing apparatus
AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsKatsushi Yoshioka, Hiroyuki Ogura, Takuya Sanari
Life of this patent
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AssigneeDainippon Screen Mfg. Co., Ltd.
InventorsKatsushi Yoshioka, Hiroyuki Ogura, Takuya Sanari
Estimating the term…
A spin holder has a disk-like supporting portion, and a circular wall portion for supporting the back side of a substrate is formed inside the periphery of the top surface of the disk-like supporting portion. A circular groove is formed near the periphery of the top surface of the disk-like supporting portion, the circular groove surrounding the outside of the circular wall portion. An O ring is fitted into the circular groove. The top surface of the circular wall portion on the spin holder supports the back side of the substrate and the O ring comes in close contact with the back side of the substrate. Even if a vacuum leakage occurs between the circular wall portion and the back side of the substrate due to suction force created by a vacuum suction source, the O ring keeps the hermetic state in the space between the circular wall portion and the O ring. This prevents mist around the spin holder from being drawn toward the suction surface between the O ring and the substrate.
A substrate processing apparatus for applying given processing to a substrate while rotating the substrate, comprising:
A substrate processing apparatus for applying given processing to a substrate while rotating the substrate, comprising:
A substrate processing apparatus for applying given processing to a substrate while rotating the substrate, comprising:
Dependencies are inferred from the claim text.
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No related US applications are recorded in the indexed filing history.
Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of…:…
Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders: vacuum work holders
For supporting or gripping: using vacuum or suction, e.g. Bernoulli chucks
Cleaning and liquid contact with solids: semiconductor wafer
Term ended 5 Oct 2018 (estimated)
USPTO file history isn’t available for this patent, so only indexed dates are shown.
1. Field of the Invention
The present invention relates to a substrate processing apparatus for applying given processing to a substrate while rotating the substrate.
2. Description of the Background Art
FIG. 1 is a schematic section showing a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a sectional view showing the spin holder of the substrate processing apparatus shown in FIG. 1.
FIG. 3 is the plane view of the spin holder of the substrate processing apparatus shown in FIG. 1.
FIG. 1 is a schematic sectional view showing a substrate processing apparatus according to a first embodiment of the present invention. In this embodiment, a spin coater will be explained as an example of a substrate processing apparatus.
In FIG. 1, the substrate processing apparatus has a vacuum-suction type spin holder (spin chuck) 20 for holding a substrate W by suction in a horizontal attitude. The spin holder 20 is attached on the top end of a rotating shaft 2 of a motor 3 and is rotation-driven around the vertical axis. The rotating shaft 2 of the motor 3 has a hollow structure, whose lower end is coupled to a vacuum suction source 12, such as a vacuum pump.
The vacuum suction source 12 sucks the substrate W on the spin holder 20 through a space inside the rotating shaft 2. The substrate W is thus held by suction on the spin holder 20. The structure of the spin holder 20 will be described later.