Apparatus and method for use in manufacturing semiconductor devices

A fixture for use in selectively positioning a semiconductor device and a depositor in a manufacturing process;

• said semiconductor device including an input-output (IO) face having a plurality of IO lands;
• said semiconductor device and said depositor being positioned in an operating position in substantially abutting relation with said IO face adjacent said depositor and said plurality of IO lands substantially in register with a plurality of cavities in said depositor;
• the fixture comprising:
• a base member;
• said base member holding said depositor in said operating position;
• an urging member;
• said urging member urging said semiconductor device against said base member in said operating position;
• and
• a separating member;
• said separating member being configured for actuation while said semiconductor device and said depositor are in said operating position and are exposed to appropriate ambient conditions to effect reflow of solder material in said plurality of cavities;
• said actuation moving said semiconductor device and said depositor to an interim orientation;
• said interim orientation establishing a separation distance intermediate said depositor and said semiconductor device appropriate to disengage said solder material from said depositor.

An apparatus for use in manufacturing a semiconductor device;

• said semiconductor device including an input-output (IO) face having a plurality of IO lands;
• said semiconductor device being situated in an operating position in substantially abutting relation with a depositor;
• the apparatus comprising:
• a first holding member;
• said first holding member holding said depositor in said operating position;
• a second holding member;
• said second holding member holding said semiconductor device in said operating position;
• said depositor and said semiconductor device cooperating in said operating position to deposit solder ball connection structures to said IO lands;
• and a separating means for moving at least one of said depositor and said semiconductor device from said operating position to an interim orientation;
• said interim orientation establishing a separation distance intermediate said depositor and said semiconductor device appropriate to disengage said solder ball connecting structures from said depositor, and wherein said apparatus includes a bias member manufactured of a material having a thermal coefficient of expansion to cause said bias member to extend beyond said face when said apparatus is subjected to temperatures appropriate for solder reflow.

A fixture for use in selectively positioning a semiconductor device and a depositor in a manufacturing process;

• said semiconductor device including an input-output (IO) face having a plurality of IO lands;
• said semiconductor device and said depositor being positioned in an operating position in substantially abutting relation with said IO face adjacent said depositor and said plurality of IO lands substantially in register with a plurality of cavities in said depositor;
• the fixture comprising:
• a base member;
• said base member holding said depositor in said operating position;
• an urging member;
• said urging member urging said semiconductor device against said base member in said operating position;
• and
• a separating member;
• said separating member being configured for actuation while said semiconductor device and said depositor are in said operating position and are exposed to appropriate ambient conditions to effect reflow of solder material in said plurality of cavities;
• said actuation moving said semiconductor device and said depositor to an interim orientation;
• said interim orientation establishing a separation distance intermediate said depositor and said semiconductor device appropriate to disengage said solder material from said depositor, and wherein said fixture includes a bias member manufactured of a material having a thermal coefficient of expansion to cause said bias member to extend beyond said face when said fixture is subjected to temperatures appropriate for solder reflow.