Method and apparatus for in-situ cleaning of polysilicon-coated quartz furnaces
AssigneeAdvanced Micro Devices, Inc.
InventorsMark C. Gilmer, Mark I. Gardner, Robert Paiz
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AssigneeAdvanced Micro Devices, Inc.
InventorsMark C. Gilmer, Mark I. Gardner, Robert Paiz
Estimating the term…
An apparatus for in-situ cleaning of polysilicon-coated quartz furnaces are presented. Traditionally, disassembling and reassembling the furnace is required to clean the quartz. This procedure requires approximately four days of down time which can be very costly for a company. In addition, cleaning the quartz requires large baths filled with a cleaning agent. These baths occupy a large amount of laboratory space and require a large amount of the cleaning agent. Cleaning the furnace in-situ eliminates the very time consuming procedure of assembling and disassembling the furnace and at the same time requires less laboratory space and less amount of cleaning agent. The polysilicon remover may be either a mixture of hydrofluoric and nitric acid or TMAH. TMAH is preferred because it less hazardous than hydrofluoric acid and compatible with more materials. The cleaning agent may be introduced into the furnace either from the built-in injectors or from additionally installed injectors. If the built-in injectors are used, the input system of the furnace is cleaned in addition to the quartz inner lining.
An apparatus for cleaning a semiconductor process tool wherein the semiconductor process tool comprises a chamber, said apparatus comprising:
Dependencies are inferred from the claim text.