High-sensitivity strain probe
AssigneeIndustrial Technology Research Institute
InventorYung-Shi Lin
Life of this patent
Estimating the term…
Abstract
The present invention is a high-sensitivity strain probe used in high-sensitivity sensor elements of force type. By the use of semiconductor process and wire bonding technology as well as integrated forming method, the fabricated elements include: a probe, a cantilever, a cantilever substrate, resistance materials, and a processing circuit that can be applied to a probe microscope to greatly reduce the number of elements of the scanning probe microscopy. The invention attains the object of lowering the cost and effectively solves the problems of an excessively large signal-to-noise ratio and avoids using the optical elements present in a conventional microscopic probe avoiding various inconveniences and shortcomings of the prior art.
Claims6
A method of fabrication of a high-sensitivity strain probe comprising the following steps:
- providing a cantilever substrate,
- shaping the cantilever substrate,
- forming a pit in the cantilever substrate so as to provide a mold for a probe,
- forming the probe in the pit,
- forming a cantilever on the cantilever substrate and the probe such that the probe depends from the cantilever,
- forming a resistance material on the cantilever,
- forming a plurality of pads on the cantilever,
- removing a portion of the cantilever substrate up to a plane of the cantilever,
- depositing a processing circuit on the cantilever, and
- providing wires connecting the plurality of pads, processing circuit and resistance material.
Dependencies are inferred from the claim text.