System and method for wiring electronic components in a three-dimensional manner

Abstract

A system and method for wiring electronic components in a three-dimensional manner. The wiring system includes a means for temporarily placing components on a substrate, a means for directly or indirectly connecting electrodes of the components together with wires, a means for removing the temporarily-placed components from the substrate, and a means for rearranging the components in a three-dimensional manner. The movable section permits the means for bonding to bond the wires to the components from any direction in the three-dimensional space. The means for directly or indirectly connecting the electrodes of the components together with wires includes a means for placing a wiring-branch pad in a space between the electrodes of the components to be indirectly connected together, and a means for bonding the electrodes of the components to the wiring-branch pad. The means for bonding the electrodes of the components to the wiring-branch pad includes a bonding head having a capillary, and a movable section for axially orienting the capillary of the bonding head in a three-dimensional space. The wiring-branch pad includes unit pads, each for electrically bonding a wire thereto, and virtual lines separating the unit pads from one another. The virtual lines prevent, via surface tension, melted metal from flowing onto adjacent ones of the unit pads from a particular one of the unit pads when bonding a wire to the particular one of the unit pads.

Dependencies are inferred from the claim text.