US 6,147,582 AGranted

Substrate supported three-dimensional micro-coil

AssigneeRaytheon Company

InventorsCharles L. Goldsmith, Andrew Malczewski, John C. Ehmke, Zhimin Yao

Life of this patent

Estimating the term…

Loading patent…

Abstract

A method of forming a three-dimensional micro-coil on a substrate (10) is provided which consists of forming a first metal layer (14) on the substrate (10). The first metal layer (14) is partitioned into a first plurality of metal strips (16). A sacrificial layer (18) is formed on the first plurality of metal strips (16). A second metal layer (24) is formed on the sacrificial layer (18). The second metal layer (24) is then partitioned into a second plurality of metal strips (26) such that a continuous loop of metal is formed between the first plurality of metal strips (16) and the second plurality of metal strips (26). This continuous loop of metal defines windings for a three-dimensional micro-coil (28) with one side in contact with the substrate (10).

Claims6

Dependent claims

A three-dimensional micro-coil, comprising:

a substrate layer;
a first plurality of metal strips formed on and in contact with one surface of the substrate, the first plurality of metal strips arranged in a substantially parallel configuration;
a second plurality of metal strips, each metal strip of the second plurality having a substantially flat upper section and first and second side sections joined at a substantially 90.degree. angle to the flat upper sections, and first and second rounded intermediate sections joining the first and second side sections to the flat upper section;
and
each of the first and second side sections connected directly to the ends of adjacent metal strips of the first plurality to form a configuration wherein the first plurality of metal strips has a surface thereof exposed to a surface of the metal strips of the second plurality.

2 more elements

Dependencies are inferred from the claim text.