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US 6,147,506 AGranted
Wafer test fixture using a biasing bladder and methodology
AssigneeInternational Business Machines Corporation
InventorsUmar M. U. Ahmad, Eugene R. Atwood
Life of this patent
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Abstract
A wafer test and burn-in fixture and methodology including a wafer probe having flexible tabs and a load board coupled to the wafer probe using the flexible tabs. The fixture also includes a bladder which biases the wafer probe to contact a wafer. A temperature control apparatus is provided to control the temperature of the wafer probe and the wafer. Tests are performed on the wafer using built-in self tests or wrap wiring tests.
Claims37
A test apparatus for testing a wafer comprising:
- a wafer probe of a material with substantially the same thermal expansion characteristics as the wafer being tested, the wafer probe including a plurality of flexible tabs of a flat shape and positioned generally horizontally between the load board and the wafer probe;
- a load board coupled to the wafer probe by the flexible tabs;
- a bladder for biasing the wafer probe;
- and
- testing means for testing the wafer using a reduced pin test methodology.
2 more elements
A test apparatus for testing a wafer comprising:
- a wafer probe including flexible tabs, the wafer probe of a material with substantially the same thermal expansion characteristics as the wafer being tested;
- a load board coupled to the wafer probe using the flexible tabs of a generally flat shape to be positioned horizontally between the load board and the wafer probe;
- a bladder which biases the wafer probe to contact the wafer;
- and
- temperature control means for controlling the temperature of the wafer probe and the wafer.
2 more elements
A method for testing a wafer comprising the steps of:
- (a) providing a wafer probe which is of a material with substantially the same thermal expansion characteristics as the wafer being tested, the wafer probe including a plurality of flexible tabs for coupling the wafer probe to a load board, the flexible tabs being of a generally flat shape and positioned generally horizontally between the load board and the wafer probe;
- (b) biasing the wafer probe to contact the wafer;
- and
- (c) testing the wafer using at least one of a built-in self test and a warp wiring test.
1 more element
Dependencies are inferred from the claim text.