Back to results
US 6,147,400 AGranted
Connecting multiple microelectronic elements with lead deformation
AssigneeTessera, Inc.
InventorsTony Faraci, Thomas H. DiStefano, John W. Smith
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeTessera, Inc.
InventorsTony Faraci, Thomas H. DiStefano, John W. Smith
Estimating the term…
A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a first surface of the array. A flexible, dielectric sheet with terminals thereon overlies the first or contact bearing surface of the semiconductor chips. Elongated leads are disposed between the dielectric element and the semiconductor chips. Each lead has a first end connected to a terminal on the dielectric element, and a second end connected to a contact on a semiconductor chip in the array. All of the leads are formed simultaneously by moving the dielectric element and the array relative to one another to simultaneously displace all of the first ends of the leads relative to all of the second ends. The dielectric element is subdivided after the forming step so as to leave one region of the dielectric element connected to each chip and thereby form individual units each including one chip, or a small number of chips.
A chip array comprising a holding element and a plurality of separate chips each having a contact-bearing surface with a plurality of electrical contacts thereon, said chips being releasably secured in an array on said holding element so that said contact-bearing surfaces face upwardly away from the holding element and thereby define a first surface of said array with said contacts being exposed at said first surface, said contacts on said chips being disposed in at preselected locations relative to one another.
A chip assembly including a plurality of separate chips each having a front surface a plurality of edges bounding the front surface and rows of contacts on said front surface adjacent said edges, the assembly further including a holding element, said chips being releasably secured to said holding element, said holding element supporting said chips so that said front surfaces are substantially co-planar and so that at least some of said edges are spaced apart from one another.
Apparatus for securing semiconductor chips to a sheet characterized by
Apparatus for securing semiconductor chips to a sheet comprising:
Dependencies are inferred from the claim text.