Back to results
US 6,147,301 AGranted
Graphite-fiber enhanced molded plastic for electronic enclosures
AssigneeIntel Corporation
InventorRakesh Bhatia
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeIntel Corporation
InventorRakesh Bhatia
Estimating the term…
A technique for fabricating an improved electronic enclosure. The electronic enclosure is made of graphite fibers dispersed directionally (non-homogeneous) in an absolac/polycarbonate (ABS/PC) resin mix, of which the composition is molded to form the the plastic enclosure. The graphite concentration is highest along the interior surface of the enclosure to provide improved heat transfer, as well as adequate EMI/RFI shielding. However, the graphite concentration decrease along the thickness, wherein at the outer surface, the graphite concentration level is zero. The directional variation in the graphite loading allows high graphite loading at the interior surface of the enclosure, but retains lower loading at other regions along the thickness so that rigidity and impact resistance are retained for the enclosure.
An enclosure comprising:
The enclosure of claim 19 wherein the additive concentration along the interior surface of the enclosure is of sufficient concentration in the plastic material to provide shielding for electrical or magnetic interference.
An improved electronic enclosure formed to provide a rigid support housing for an electronic component, said enclosure fabricated from a plastic material, said improvement comprising an additive directionally distributed along a thickness of the plastic material, said directional distribution having a varying additive concentration with a higher additive concentration proximal to an interior surface of said enclosure than along an exterior surface of said enclosure, said higher additive concentration being sufficient to provide shielding for electrical or magnetic interference and being approximately 50% by volume to said plastic material to correspond with approximately 100 Watts per meter Kelvin of thermal conductivity.
An enclosure for housing an electronic component comprising:
Dependencies are inferred from the claim text.