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US 6,147,141 AGranted
Die attach adhesive compositions
AssigneeShell Oil Company
InventorsShridhar R. Iyer, Pui Kwan Wong
Life of this patent
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Abstract
A novel thermally reworkable die attach adhesive composition for attaching a semiconductor device to a substrate is provided. The composition comprises (a) a thermally reworkable crosslinked resin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and (b) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium.
Claims10
A process for attaching a semiconductor device to a substrate comprising:
- (a) providing a substrate;
- (b) dispensing, on at least a portion of said substrate, a thermally reworkable die attach adhesive composition, said composition comprising
- (i) a thermally reworkable crosslinked fesin produced by reacting at least one dienophile having a functionality greater than one and at least one 2,5-dialkyl substituted furan-containing polymer, and
- (ii) at least one thermally and/or electrically conductive material present in an effective amount up to about 90% by weight of the die attach composition to provide a conducting medium, at a temperature which is sufficiently high to convert the die attach adhesive composition into a liquid thereby producing an adhesive-attached substrate;
- (c) attaching the semiconductor device on the surface of the thermally reworkable die attach adhesive on the adhesive-attached substrate while the adhesive is in a liquid, thereby bonding the semiconductor device to the substrate;
- and,
- (d) cooling the die attach adhesive to a temperature which is sufficiently low to solidify the resin thereby providing an assembly.
4 more elements
Dependencies are inferred from the claim text.