Process for removing contaminant from a surface and composition useful therefor
AssigneeAshland Inc.
InventorEmil Anton Kneer
Life of this patent
Estimating the term…
Abstract
Particulate and metal ion contamination is removed from a surface, such as a semiconductor wafer containing copper damascene or dual damascene features, employing aqueous composition comprising a fluoride containing compound; a dicarboxylic acid and/or salt thereof; and a hydroxycarboxylic acid and/or salt thereof.
Claims23
An aqueous composition comprising about 0.5% to about 5% by weight of fluoride containing material, about 0.05% to about 1% by weight of at least one dicarboxylic acid, salt thereof or mixture thereof;
- about 0.5 to about 5% by weight of at least one hydroxy carboxylic acid, salt thereof or mixture thereof;
- and the remainder being substantially water, and
- having a pH of about 3.0 to about 5.7.
A process for removing particulate contaminants from a copper surface after CMP planarization which comprises contacting a copper surface that has been planarized by CMP with an aqueous composition comprising a fluoride containing material;
- at least one dicarboxylic acid, salt thereof or mixtures thereof;
- and
- at least one hydroxycarboxylic acid, salt thereof or mixtures thereof, and having a pH of about 3.0 to about 5.7.
A process for fabricating semiconductor integrated circuits comprising:
- forming circuits on the surface of a semiconductor wafer by photolithographic process wherein the circuits comprise copper or copper alloy;
- planarizing the surface by chemical mechanical polishing;
- and removing particulate contaminants from the surface by contacting with a aqueous composition comprising fluoride containing material;
- at least one dicarboxylic acid, salt thereof or mixture thereof;
- and at least one hydroxy carboxylic acid, salt thereof or mixtures thereof and having a pH of about 3.0 to about 5.7.
An aqueous composition comprising about 1 to about 20% by weight of the fluoride containing material;
- about 1 to about 10% by weight of a dicarboxylic acid, salt thereof, or mixtures thereof;
- about 1 to about 30% by weight of a hydroxy carboxylic acid;
- salt thereof or mixtures thereof, and 30 to about 50% by weight or water.
Dependencies are inferred from the claim text.