Method of smoothing fluorine-containing resin molded article and smoothed molded article
AssigneesTadahiro Ohmi, Daikin Industries, Ltd.
InventorsTadahiro Ohmi, Katsuhide Ohtani
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Abstract
A fluorine-containing resin molded article can be obtained by putting it between smooth molds having a surface roughness (Ra) of not more than 50 .ANG. and compression-molding it under molding conditions of a molding temperature of 270.degree. to 340.degree. C., a molding pressure of not less than 10 kg/cm.sup.2 and compression time of not less than 2 minutes, to give smoothed fluorine-containing resin molded article having a surface roughness of not more than 500 .ANG.. Particles, metal impurities, organic impurities or the like are difficult to adhere to the surface of the article, and can be removed significantly by washing.
Claims4
A method of processing a semiconductor comprising use of a smoothed fluorine-containing resin molded article for preventing contamination of the semiconductor, the smoothed fluorine-containing resin molded article having a surface roughness (Ra) of not more than 500 .ANG. and being resilient in avoiding adhesion of metal impurities thereto, which is obtained by subjecting the fluorine-containing resin molded article to compression molding by simultaneous application of heat and pressure at a molding temperature of 270.degree. to 340.degree. C. and a molding pressure of not less than 10 kg/cm.sup.2 for a compression time of not less than 2 minutes.
A method of processing a semiconductor in an ultra-clean manufacturing process, which comprises:
- conducting the ultra-clean manufacturing process using equipment made from a smoothed fluorine-containing resin molded article for preventing contamination of the semiconductor, the smoothed fluorine-containing resin molded article having a surface roughness (Ra) of not more than 500 .ANG. and being resilient in avoiding adhesion of metal impurities thereto, which is obtained by subjecting the fluorine-containing resin molded article to compression molding by simultaneous application of heat and pressure at a molding temperature of 270.degree. to 340.degree. C. and a molding pressure of not less than 10 kg/cm.sup.2 for a compression time of not less than 2 minutes.
Dependencies are inferred from the claim text.