Package stack via bottom leaded plastic (BLP) packaging
AssigneeMicron Technology, Inc.
InventorPatrick W. Tandy
Life of this patent
Estimating the term…
Abstract
A packaged semiconductor device has bottom surface leads having portions of the package adjacent the lead edges excised. The outer leads may take the form of inverted-J leads, short stub leads, vertically bent leads-in-grooves, or may be entirely eliminated. Lead connections are on the bottom package surface, over the top package surface, and/or on the sides and ends of the package, enabling vertical stacking of the devices and simultaneous/alternative coplanar horizontal connections to other semiconductor devices, circuit boards, etc. A mold assembly with a castellated inner surface forms a package with alternating grooves and columns for holding side and end electrical connection surfaces.
Claims11
A method for forming a semiconductor device, comprising:
- providing a semiconductor die;
- forming a leadframe having at least one lead;
- preparing a semiconductor die-leadframe assembly including electrical connections between the semiconductor die and the at least one lead of the leadframe;
- aligning the semiconductor die-leadframe assembly in a cavity of a mold assembly having a top plate and a bottom plate wherein an intermediate portion of the at least one lead is adjacent to a floor of said bottom plate;
- closing the mold assembly and injecting fluid polymeric encapsulant to fill a mold assembly cavity;
- removing a molded polymeric package from said mold assembly;
- and
- configuring outer leads to a desired configuration.
A method for forming a semiconductor device, comprising:
- providing a semiconductor die;
- forming a leadframe having at least one lead;
- preparing a semiconductor die-leadfrarne assembly including electrical connections between the semiconductor die and the at least one lead of the leadframe;
- aligning the semiconductor die-leadframe assembly in a cavity of a mold assembly having a top plate and a bottom plate wherein an intermediate portion of at the least one lead is adjacent to a floor of said bottom plate;
- closing the mold assembly and injecting fluid polymeric encapsulant to fill a mold assembly cavity;
- curing the encapsulant;
- removing a molded polymeric package from said mold assembly;
- deflashing a bottom of the molded polymeric package and portions of outer leads to remove flash residue from attachment areas of said outer leads;
- lancing the semiconductor die-leadframe to singulate the outer leads;
- and
- configuring said outer leads to a desired configuration.
Dependencies are inferred from the claim text.