Method of fabricating a semiconductor package
AssigneeLG Semicon Co., Ltd.
InventorJu-Hwa Lee
Life of this patent
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Abstract
A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars exposed to upper and lower surfaces of the insulator, a semiconductor chip on the semicondcutor package substrate, an upper surface of the semiconductor chip being attached to the lead bars, a plurality of pads on a center portion of an upper surface of the semiconductor chip, a plurality of wires respectively connecting the pads with an upper surface of the lead bars, and an upper cover protecting the wires, the pads and an upper surface of the semiconductor chip.
Claims12
A method of fabricating a semiconductor package, comprising the steps of;
- forming a semiconductor package substrate having a frame-type insulator which has a penetrating portion in a center of the semiconductor package substrate and a plurality of leads buried in both circumferential surfaces of the insulator at both sides of the penetrating portion;
- attaching an upper surface of a semiconductor chip having a plurality of pads on a center portion to lower surfaces of the leads;
- connecting the pads with upper surfaces of the corresponding leads by wires;
- and
- forming an upper cover to protect the wires, the pads, and an upper surface of the semiconductor chip.
A method of fabricating a semiconductor package, comprising the steps of;
- forming a semiconductor package substrate having a frame-type insulator which has a penetrating portion in a center of the semiconductor package substrate and a plurality of leads buried in both circumferential surfaces of the insulator at both sides of the penetrating portion;
- attaching an upper surface of a semiconductor chip on a center portion to lower surfaces of the leads using a conductive adhesive;
- and
- forming an upper cover to protect an upper surface of the semiconductor chip.
Dependencies are inferred from the claim text.