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US 6,146,912 AGranted
Method for parallel alignment of a chip to substrate
AssigneeTRW Inc.
InventorsThomas S. Tighe, Gershon Akerling
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Abstract
A method and apparatus for bonding a chip to a substrate is described, wherein the apparatus includes a chip holder assembly comprising an outer holder having a cavity formed therein and an inner holder for holding the chip, and by releaseably securing the inner holder within the outer holder cavity and contacting the chip to the substrate the inner holder has selective angular rotation within the cavity to make parallel the chip and the substrate.
Claims3
A method for parallelly aligning a chip to a substrate, comprising:
- applying a first vacuum to hold said chip to an inner holder;
- applying a second vacuum to releaseably hold said inner holder within a cavity formed on an outer holder;
- placing said chip in contact with said substrate;
- releasing said second vacuum and allowing said inner holder to rotate within said cavity while said chip aligns parallel with said substrate;
- and
- reapplying said second vacuum to secure said inner holder orientation.
3 more elements
Dependencies are inferred from the claim text.