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AssigneeApplied Kinetics, Inc.
InventorsMark T. Girard, Ryan A. Jurgenson
Estimating the term…
The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed shunt sites wherein there is at least one through hole in the substrate.
A method for substantially protecting an electronic component from ESD/EOS, said component including a plurality of spaced apart leads for conducting electric current and a carbonizable material engaging at least one surface of each of at least a pair of adjacent leads, said method comprising:
A method for protecting an electronic component from damage caused by ESD/EOS, said component including a plurality of leads for conducting electric current supported at least in part on a substrate, said method comprising:
A method of protecting an electronic component from EDS/EOS, said component including a plurality of leads for conducting electric current supported at least in part on a substrate, said method comprising:
Dependencies are inferred from the claim text.