Solid-state energy storage module employing integrated interconnect board

An energy storage device, comprising:

• a sealed housing through which a first terminal and a second terminal pass;
• an interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals, the interconnect board including an electrically conductive surface comprising a connection pattern that provides selective connectivity with a plurality of electrochemical cells;
• a first group of electrochemical cells of the plurality of electrochemical cells connected through the interconnect board in parallel to form a first cell pack;
• a second group of electrochemical cells of the plurality of electrochemical cells connected through the interconnect board in parallel to form a second cell pack;
• and
• the first and second cell packs connected through the interconnect board in series.

A solid-state energy storage device, comprising:

• a sealed housing through which a first terminal and a second terminal pass;
• a plurality of thin-film electrochemical cells disposed in the housing;
• an interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals of the housing, the interconnect board including a surface comprising a plurality of connection regions each being connected to particular ones of the plurality of electrochemical cells;
• a plurality of series connected current bypass devices that electrically couple the connection regions together and to the first and second contacts of the interconnect board.

A solid-state energy storage device, comprising:

• a sealed housing through which a first terminal and a second terminal pass;
• a plurality of thin-film electrochemical cells disposed in the housing;
• an interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals of the housing, the interconnect board including a surface comprising a plurality of connection regions each being connected to particular ones of the plurality of electrochemical cells;
• and
• a plurality of parallel connected equalizer devices that electrically couple the connection regions together and to the first and second contacts of the interconnect board.

A solid-state energy storage device, comprising:

• a sealed housing through which a first terminal and a second terminal pass;
• a plurality of thin-film electrochemical cells disposed in the housing;
• an interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals of the housing, the interconnect board including a surface comprising a plurality of connection regions each being connected to particular ones of the plurality of electrochemical cells;
• and
• a plurality of parallel connected integrated equalizer and current bypass units that electrically couple the connection regions together and to the first and second contacts of the interconnect board.

A solid-state energy storage device, comprising:

• a sealed housing through which a first terminal and a second terminal pass;
• a plurality of thin-film electrochemical cells disposed in the housing;
• an interconnect board disposed in the housing and having a first contact and a second contact respectively coupled to the first and second terminals of the housing, the interconnect board including a surface comprising a plurality of connection regions each being connected to particular ones of the plurality of electrochemical cells;
• a plurality of electrically conductive elements that electrically couple the connection regions together and to the first and second contacts of the interconnect board;
• and
• at least one communications connector affixed to the interconnect board that receives a mating connector disposed on a communication line that passes through the sealed housing.