Low dielectric composition, insulating material, sealing material, and circuit board

Abstract

A low dielectric constant composition with a dielectric constant of 4 or less is disclosed. The composition comprises a matrix resin and crosslinked resin particles having an average particle diameter in the range from 0.03 to 10 .mu.m, the crosslinked resin particles being prepared by the polymerization of 1-100 wt % of cross-linking monomers and 0-99 wt % of non-cross-linking monomers, having a dielectric constant of 3 or less, and having a 50 ppm or less average concentration of metal ions. The composition exhibits superior insulation properties and capable of producing an insulating material and sealing material with a low dielectric constant and low dielectric loss tangent (tan .delta.). An insulating material and a sealing material comprising this low dielectric composition and a circuit board provided with the insulating material or sealing material are also disclosed.

Dependencies are inferred from the claim text.