Structure and method for molding optical disks

A method for molding an optical disk comprising:

• applying a thermally insulative mold insert having minimal surface features to an adhesive coated metal frame,
• heating the thermally insulative mold insert and the metal frame,
• cooling the thermally insulative mold insert and the metal frame, and then
• applying a thermally insulative insert coating by spin, spray, dip, or meniscus coating the thermally insulative insert coating to the thermally insulative mold insert to provide at least one coated mold insert having a reduced surface roughness,
• positioning the at least one coated mold insert between a thermally conductive mold form and a portion of a thermally conductive mold apparatus,
• injecting a molten thermoplastic material into the mold apparatus,
• retaining the molten thermoplastic in the mold apparatus for a time sufficient for the molten thermoplastic material to cool below its glass transition temperature to form the optical disk, and
• ejecting the optical disk from the mold apparatus.

A method for molding an optical disk comprising:

• securing a thermally insulative mold insert having minimal surface features between two metal rings to provide a flat surface of the thermally insulative mold insert;
• applying a thermally insulative insert coating by spin, spray, dip, or meniscus coating the thermally insulative insert coating to at least one thermally insulative mold insert to provide at least one coated mold insert having a reduced surface roughness;
• positioning the at least one coated mold insert between a thermally conductive mold form and a portion of a thermally conductive mold apparatus;
• injecting a molten thermoplastic material into the mold apparatus;
• retaining the molten thermoplastic in the mold apparatus for a time sufficient for the molten thermoplastic material to cool below its glass transition temperature to form the optical disk;
• and
• ejecting the optical disk from the mold apparatus.

An optical disk mold apparatus comprising:

• at least one thermally conductive mold form
• at least one thermally insulative mold insert, the mold insert having a coefficient of thermal expansion compatible with the coefficient of thermal expansion of the mold form;
• a layer comprising an adhesive or an adhesion promoter overlying the mold form, the mold insert positioned on the layer and the mold form;
• and
• a thermally conductive mold apparatus,
• the at least one coated mold insert positioned between the thermally conductive mold form and a portion of the thermally conductive mold apparatus.