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US 6,146,504 AGranted
Substrate support and lift apparatus and method
AssigneeApplied Materials, Inc.
InventorsNalin Patadia, Charles Carlson
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AssigneeApplied Materials, Inc.
InventorsNalin Patadia, Charles Carlson
Estimating the term…
The present invention provides optimized designs that allow the coverage of the full surface of a receiving face in a substrate while at the same time reducing material deposition on the edge of the substrate, material deposition on and/or scratching of the backside of the substrate. While the methods and apparatus of the invention are described within the framework of aluminum deposition chambers, it is contemplated that the invention will be equally effective in all other semiconductor processing chambers where avoiding edge and/or backside deposition, scratching, and/or sticking may be desirable. The invention provides a support member having a deposit collection channel with slanted walls to trap deposit particles that do not depose of the substrate thus preventing deposition and sticking in the backside of a processed substrate. The invention also provides a resting and lifting mechanism to minimize friction between the backside of the substrate and the support member thus reducing contamination of the chamber environment by particles released due to scratching of the backside of the substrate.
A processing chamber, comprising:
A semiconductor substrate deposition chamber comprising:
A semiconductor substrate deposition chamber, comprising:
A semiconductor substrate deposition chamber, comprising:
A method of depositing material on a substrate in a processing chamber, the substrate having front and back sides, the method comprising:
Dependencies are inferred from the claim text.