Weld bonding method
AssigneesFurukawa Electric Co., Ltd., Sunstar Giken Kabushiki Kaisha
InventorsToshiya Okada, Tomiharu Okita, Yasuhiro Okuri, Kiichi Yamashita
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Abstract
The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.
Claims8
A weld bonding method for bonding metal surfaces together with adhesion both by an adhesive and by resistance spot welding through the adhesive, comprising the steps of:
- preparing the adhesive by admixing a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more conductive additives selected from the group consisting of metal, metal oxide, metal carbide, metal nitride, metal boride and metal silicide, said additive being in the form of a powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of at least 0.5 .mu.m and a particle size of 30 .mu.m or less;
- applying the adhesive to at least one of the metal surfaces to be bonded;
- then spreading the applied adhesive;
- then placing the metal surfaces together with the spread adhesive therebetween;
- then spot welding the metal surfaces together;
- and then heating the metal surfaces to cure the adhesive whereby the additive improves conductivity to enhance the strength of the spot welds.
Dependencies are inferred from the claim text.