Flexible laminate for flexible circuit
AssigneeGA-TEK Inc.
InventorsMichael A. Centanni, Mark Kusner
Life of this patent
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Abstract
Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.
Claims10
A method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of:
- depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide film having at least one layer of metal on said first side;
- modifying a second side of said polyimide strip to increase the surface energy thereof;
- applying an adhesive onto said second side of said generally continuous strip of polyimide, said adhesive being formed of a substantially uncured, polymeric material, said polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface;
- and
- curing said adhesive wherein at least an outermost region of said adhesive strip is only partially cured.
A method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of:
- modifying a first side and a second side of a generally continuous polyimide strip to increase the surface energy thereof;
- depositing at least one layer of metal on said first side of said generally continuous strip of polyimide film;
- depositing a continuous layer of copper on said at least one layer of metal on said first side of said generally continuous strip of polyimide film;
- applying an adhesive onto said second side of said generally continuous strip of polyimide, said adhesive being formed of a substantially uncured, polymeric material, said polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface;
- and
- curing said adhesive wherein at least an outermost region of said adhesive strip is only partially cured.
A method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of:
- a) depositing a continuous layer of copper on a first side of a generally continuous strip of polyimide film having a layer of metal on said first side;
- b) exposing a second side of said polyimide film to a chemical plasma at sufficient levels to modify the surface energy of said polyimide film;
- c) applying at least one layer of metal to said second side of said polyimide film;
- d) applying an adhesive onto said at least one layer of metal on said second side of said polyimide film, said adhesive being formed of a substantially uncured, polymeric material, said polymeric material having properties in its uncured state wherein it will not flow under pressure exerted along its planar surface;
- and
- e) inductively heating said polyimide film to cure said adhesive, wherein at least an outermost region of said adhesive is only partially cured.
Dependencies are inferred from the claim text.