Flux management system for a solder reflow oven

Abstract

A flux vapor management system for a reflow oven includes temperature control units disposed in heating and cooling regions of the oven. A fan within each of the temperature control units provides suction to an intake port. Intake ports of selected temperature control units in the heating region of the oven are connected with a barrier vent disposed between the heating and cooling regions of the oven. Gas drawn into the barrier vent by the suction from the intake ports prevents flux laden gas from migrating into the cooling region. The flux vapor management system also includes a filter for removing flux vapors from a reflow oven. The filter condenses flux vapors by converging a jet of hot gas from the oven with a cooled gas jet causing the flux vapors to condense while suspended in the gas stream. The flux laden gas does not contact any solid surface below the flux condensation temperature so there is no build-up of flux within the apparatus. The condensed flux forms particles or droplets that are trapped by a filter. A portion of the filtered gas is directed through a heat exchanger to create the cooled gas stream.

Dependencies are inferred from the claim text.