Carrier head with local pressure control for a chemical mechanical polishing apparatus
AssigneeApplied Materials, Inc.
InventorsSteven M. Zuniga, Hung Chih Chen, Manoocher Birang, Kapila Wijekoon, Sen-Hou Ko
Life of this patent
Estimating the term…
Abstract
A carrier head for a chemical mechanical polishing apparatus includes a flexible membrane, the lower surface of which provides a substrate-receiving surface. The carrier head may include a projection which contacts an upper surface of the flexible membrane to apply an increased load to a potentially underpolished region of a substrate. Fluid jets may be used for the purpose.
Claims28
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure movably connected to the base;
- a flexible member connected to and extending beneath the support structure, a lower surface of the flexible member providing a substrate-receiving surface;
- and
- a projection extending from the support structure to contact an upper surface of the flexible member at a location interior to an outer perimeter of the substrate-receiving surface.
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure movably connected to the base;
- a flexible member connected to and extending beneath the support structure, a lower surface of the flexible member providing a substrate-receiving surface;
- and
- a projection extending from the support structure to contact an upper surface of the flexible member at a location interior to an outer perimeter of the substrate-receiving surface to apply an increased load to a portion of a substrate positioned on the substrate-receiving surface.
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure movably connected to the base, the support structure including an annular recess in a lower surface thereof;
- a flexible member connected to and extending beneath the support structure, a lower surface of the flexible member providing a substrate-receiving surface;
- and
- an O-ring fitted into the recess and extending from the support structure to Provide a projection to contact an upper surface of the flexible member at a location interior to an outer perimeter of the substrate-receiving surface.
A carrier head for a chemical mechanical polishing apparatus, comprising:
- a base;
- a support structure connected to the base;
- a flexible member connected to and extending beneath the support structure to define a chamber, a lower surface of the flexible member providing a substrate-receiving surface, the chamber being pressurizable to providing a first force to an upper surface of the flexible member;
- and
- means for applying a second, additional force to the upper surface of the flexible member in a localized contact area located interior to an outer edge of the substrate-receiving surface.
A carrier head, comprising:
- a base;
- a flexible membrane extending beneath the base to define a first chamber, a lower surface of the flexible membrane providing a substrate-receiving surface;
- a projection to contact a portion of an upper surface of the flexible membrane at a location interior to an outer perimeter of the substrate-receiving surface;
- and
- a second chamber to control a pressure of the projection on the portion of the upper surface of the flexible membrane.
A carrier head, comprising:
- a base;
- a flexible membrane extending beneath the base to define a first chamber, a lower surface of the flexible membrane providing a substrate-receiving surface, the first chamber controlling a first pressure of the substrate-receiving surface on a substrate;
- a rigid member to contact a portion of an upper surface of the flexible membrane at a location interior to an outer perimeter of the substrate-receiving surface;
- and
- a second chamber to bias the member against the upper surface of the flexible membrane and apply a second pressure on a region of the substrate corresponding to the portion of the flexible membrane contacted by the member.
Dependencies are inferred from the claim text.