Apparatus for uniform chemical mechanical polishing by intermittent lifting and reversible rotation
AssigneeFujitsu Limited
InventorsMichael G. Lee, Solomon I. Beilin
Life of this patent
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AssigneeFujitsu Limited
InventorsMichael G. Lee, Solomon I. Beilin
Estimating the term…
Methods and apparatuses for evenly polishing the entire polishing surface of a sample are described. One polishing apparatus of the present invention comprises: a platen having an upper surface upon which the sample surface is to be polished; a sample holder disposed opposite to the platen's upper surface, at least one of the platen and the sample holder being rotated about a first axis to effect polishing; a positioning means for changing the distance between the sample holder and the platen in response to a control signal; and a controller providing said control signal to the positioning means to control the operation of the positioning means during a polishing cycle, wherein the controller causes the positioning means to change the distance intermittently during the polishing cycle. One method according to the present invention comprises: dispensing slurry upon a polishing pad; polishing the sample against the polishing pad; and intermittently changing the distance between the sample and the polishing pad during the polishing step.
An apparatus for polishing a sample having a surface to be polished, said apparatus comprising:
An apparatus for polishing a sample having a surface to be polished, said apparatus comprising:
An apparatus for polishing a sample having a surface to be polished, said apparatus comprising:
An apparatus for polishing a sample having a surface to be polished, said apparatus comprising:
In a apparatus for polishing a sample having a surface to be polished, said apparatus comprising a platen having an upper surface, a sample holder disposed opposite to said platen's upper surface, a positioner which moves the sample holder between a first position which brings the sample in contact with the platen and a second position which separates the sample from contact with the platen in response to a control signal, a controller comprising:
In an apparatus for polishing a sample having a surface to be polished, said apparatus comprising a platen having an upper surface, a sample holder disposed opposite to said platen's upper surface, a motor assembly for rotating one of the sample holder and the platen in either of two directions, the direction being selectable in response to a control signal;
Dependencies are inferred from the claim text.