Gun-shaped tweezer having a non-rotatable head/body connection for adsorbing a semiconductor wafer
AssigneeSamsung Electronics Co., Ltd.
InventorYui-kun Jung
Life of this patent
Estimating the term…
Abstract
A tweezer for adsorbing a semiconductor device allows easy and safe handling of the wafer by preventing rotation of the tweezer due to the weight of a wafer adsorbed off-center, and the breakage of the wafer caused thereby. The tweezer has a gun-shaped body, including a handle having a first vacuum line, and a barrel connected to the handle, the first vacuum line extending through the barrel. The first vacuum line is opened and closed by a trigger and shutter. A head is non-rotatably attached to the barrel, the head having a second vacuum line connected to the first vacuum line for adsorbing the wafer by the vacuum supplied inside the second vacuum line.
Claims13
A tweezer for adsorbing a semiconductor wafer comprising:
- a body comprising
- a handle;
- a first vacuum line provided in the handle;
- a barrel connected to the handle, the first vacuum line extending through the barrel;
- an opening/closing means for selectively opening/closing the first vacuum line, wherein the opening/closing means comprises a trigger which is movably fixed at a lower side of the barrel by means of a fixing member and a shutter for opening/closing the first vacuum line by pressure from the trigger, the shutter comprising a head section and an insertion section which extends from the head section such that a step is formed at a junction between the head section and the insertion section;
- an outer groove formed in the handle, such that the head section of the shutter enters the outer groove by pressure from the trigger;
- a through hole formed in the handle at a base of the outer groove, such that the insertion section of the shutter fits into the through hole to communicate with the first vacuum line;
- an inner groove provided inside the handle facing the through hole, such that a free end of the insertion section of the shutter crosses the first vacuum line and enters the inner groove by pressure from the trigger so as to block the first vacuum line, and exits the inner groove by release of pressure from the trigger so as to unblock the first vacuum line;
- and
- a head connected to the barrel for adsorbing a wafer by vacuum.
Dependencies are inferred from the claim text.