Non-connected drainage channels for selective wave solder pallets

A wave solder pallet for wave soldering an area of a printed circuit board, said pallet comprising a base plate having a first and a second side wherein said base plate is adapted to receive a printed circuit board on said first side and wherein said base plate has at least one aperture extending from said first side to said second side so as to allow solder from a wave solder system to flow through said aperture and contact a selected region of the printed circuit board when said base plate is drawn across a solder wave in a first direction, said base plate also having at least one channel that extends from an outer periphery of said base plate in the first direction towards an inner end located adjacent said aperture wherein said channel extends towards said aperture in said base plate a first distance and wherein said base plate has a pressure increasing surface interposed between said inner end of said channel and said aperture so that as said base plate is moved in the first direction with respect to the solder wave, the pressure produced in the channel by the portion of the solder wave entering the aperture is increased as a result of a portion of the solder wave contacting said pressure increasing surfaces of said base plate.

A solder pallet for use in a process of wave soldering a circuit board, the pallet having a first and a second side with at least one aperture extending from the first to the second side, wherein the first side is adapted to receive a printed circuit board and wherein the second side has a channel formed therein which extends from the periphery of the pallet towards the aperture and wherein the second side further has a pressure increasing surface positioned so as to be interposed between the channel and the aperture wherein movement of the pallet relative to the solder wave causes the solder wave to initially contact the channel at a first pressure wherein the first pressure is low enough to substantially eliminate solder splashing around the pallet wherein continued movement of the pallet relative to the solder wave further causes the solder wave to contact the pressure increasing surface at a second pressure wherein the second pressure is higher than the first pressure wherein the second pressure directs a portion of the solder wave simultaneously into the aperture.