Guide rail mechanism for a bonding apparatus
AssigneeKabushiki Kaisha Shinkawa
InventorsMinoru Torihata, Shinji Maki
Life of this patent
Estimating the term…
Abstract
A guide rail mechanism for a bonding apparatus for transferring a workpiece such as a lead frame, etc. including a pair of guide rails each comprising an edge surface guide rail element for guiding the edge surface of the workpiece and an undersurface guide rail element disposed beneath the edge surface guide rail element so as to support the undersurface of the edge portion of the workpiece. A driver for the undersurface guide rail element comprised of a rotational shaft with an eccentric cam portion and other parts is installed so as to move the undersurface guide rail element, thus changing the positional relationship between the edge surface guide rail element and the undersurface guide rail element for workpieces of different thicknesses.
Claims6
A guide rail mechanism for a bonding apparatus equipped with a pair of guide rails that guide a workpiece, wherein each of said guide rails consists of:
- an edge surface guide rail element which is provided on a guide rail stand and guides an edge surface of said workpiece, and
- an undersurface guide rail element which is disposed beneath said edge surface guide rail element and supports an undersurface of an edge portion of said workpiece;
- and
- said mechanism further comprises an undersurface guide rail element driving means which raises and lowers said undersurface guide rail element.
A guide rail mechanism for a bonding apparatus equipped with a pair of guide rails that guide a workpiece, wherein each of said guide rails consists of:
- an edge surface guide rail element which is provided on a guide rail stand and guides an edge surface of said workpiece, a top of a guide section thereof being open, and
- an undersurface guide rail element which is disposed beneath said edge surface guide rail element and supports an undersurface of an edge portion of said workpiece;
- and
- said mechanism further comprises an undersurface guide rail element driving means which raises and lowers said undersurface guide rail element.
A guide rail mechanism for a bonding apparatus comprising:
- a pair of guide rails for guiding a workpiece to be conveyed, each of said pair of guide rails consisting of an edge surface guide rail element, which is provided on a guide rail stand and guides an edge surface of said workpiece, and an undersurface guide rail element, which is disposed beneath said edge surface guide rail element and supports an undersurface of an edge portion of said workpiece;
- and
- an undersurface guide rail element driving means which moves said undersurface guide rail element toward and away from said edge surface guide rail element so as to change a distance between said edge surface guide rail element and said undersurface guide rail element for workpieces of different thicknesses.
Dependencies are inferred from the claim text.