Method and apparatus for direct writing of semiconductor die using microcolumn array
OwnerC. Neil Berglund, Tai-Hon Philip Changinventors
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Abstract
In electron beam lithography, a lithography system uses multiple microcolumns in an array to increase throughput for direct writing of semiconductor wafers. The mismatch between the microcolumn array and the semiconductor die periodicity is resolved by using only one microcolumn to scan each individual die. This is accomplished by assuring that the stage carrying the semiconductor wafer moves a total distance in each of the X and Y directions which is greater than the pitch between adjacent die. Hence each die is scanned by only a single microcolumn although at possibly different times during the total stage motion.
Claims24
A method of imaging a pattern on a substrate, the pattern defining a plurality of die on the substrate, there being a pitch P between adjacent die, using an array of charged particle beam columns, comprising:
- moving the substrate in two perpendicular directions while blanking the charged particle beams on and off, thereby scanning the pattern onto the substrate;
- wherein a total distance D the substrate is moved in each of the two directions for each movement in either of the two directions is greater than P, so that only one column images each of the die in the pattern.
The lithography apparatus for imaging a pattern onto a substrate, the pattern defining a plurality of die on the substrate, there being a pitch P between adjacent die, comprising:
- an array of charged particle beam columns arranged to each direct a charged particle beam onto the substrate to define the pattern, each column including an individually controlled beam blanker;
- a support for the substrate, the support being movable in two perpendicular directions for scanning the pattern onto the substrate;
- and
- a control coupled to the stage for controlling the stage movement, wherein the control moves the stage a total distance D in each of the two directions for each movement in either of the two directions, where D is greater than P, so that only one column images each of the die in the pattern.
Dependencies are inferred from the claim text.