Method of positioning work piece and system therefor
AssigneeTokyo Seimitsu Co., Ltd.
InventorsShozo Katamachi, Shinji Shibaoka
Life of this patent
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AssigneeTokyo Seimitsu Co., Ltd.
InventorsShozo Katamachi, Shinji Shibaoka
Estimating the term…
A work piece such as a semiconductor ingot is positioned and bonded to a work piece bonding block by a bonding jig which is provided separately from a wire saw in such a manner that the central axis of the work piece and respective horizontal and vertical surfaces of the work piece bonding block come into parallel to each other. Then, the work piece bonding block is positioned and mounted at a mounting jig which is provided on a cutting-feeding table of the wire saw and which has horizontal and vertical reference surfaces perpendicularly intersecting a cutting plane, so that the central axis of the work piece automatically and perpendicularly intersects the cutting plane. Then, the mounting jig is tilted to tilt the work piece by a tilting mechanism in such a manner that the central axis is inclined against the cutting plane at a predetermined angle on the basis of shift value data of the crystal orientation with the central axis of the work piece a reference, which has previously been measured outside the wire saw.
A system for positioning a work piece on a wire saw that has a plurality of wire rows formed by at least one wire, wherein a work piece held by a work piece holding member is pressed against the wire rows at a predetermined reference angle and said work piece is cut into a plurality of wafers by the wire rows, the system comprising:
A system for positioning a work piece on a wire saw that has a plurality of wire rows formed by at least one wire, wherein a work piece held by a work piece holding member is pressed against the wire rows at a predetermined reference angle and said work piece is cut into a plurality of wafers by the wire rows, the system comprising:
Dependencies are inferred from the claim text.