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US 6,145,380 AGranted
Silicon micro-machined accelerometer using integrated electrical and mechanical packaging
AssigneeAlliedSignal Inc.
InventorDouglas C. MacGugan
Life of this patent
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Abstract
An integrated sensor package formed using low temperature co-fired ceramic assembly techniques and method for manufacturing same.
Claims24
A sensor package comprising:
- plurality of multi-layer hybrid substrates;
- a measuring device mounted on one of said substrates;
- a circuit integrated onto one of said multi-layer hybrid substrates for driving and sensing said measuring device;
- a housing formed of said substrates enclosing said measuring device and said driving and sensing circuit;
- and
- an interface for inputting power and drive signals and outputting measuring device signals.
3 more elements
A sensor package comprising:
- a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals;
- a measuring device mounted on a first one of said substrates;
- a circuit integrated into a second one of said substrates for driving and sensing said measuring device;
- a housing formed of a third and fourth one of said substrates enclosing said measuring device and said driving and sensing circuit;
- and
- an interface integrated into one of said substrates for inputting power and drive signals and outputting signals from said measuring device.
3 more elements
A sensor package comprising:
- a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals, said plurality of substrates including:
- an upper hybrid cover,
- an upper hybrid,
- a lower hybrid, and
- a lower hybrid cover;
- a measuring device mounted on one of said substrates;
- a circuit integrated into one of said substrates for driving and sensing said measuring device;
- a housing formed of at least two of said substrates enclosing said measuring device and said driving and sensing circuit;
- and
- an interface integrated into one of said hybrid covers for inputting power and drive signals and outputting signals from said measuring device.
7 more elements
An accelerometer package comprising:
- a plurality of multi-layer low temperature co-fired ceramic hybrid substrates including electrical circuits for routing electrical power and signals;
- an acceleration sensor mounted on one of said substrates;
- a circuit integrated into one of said substrates for driving and sensing said acceleration sensor;
- a housing formed of at least two of said substrates enclosing said acceleration sensor and said driving and sensing circuit;
- and
- means integrated into one of said substrates for inputting power and drive signals and outputting signals from said acceleration sensor.
3 more elements
A method of packaging a sensor comprising the steps of:
- a) forming a die carrier and a circuit on a substrate layer for mounting of a measuring device:
- b) forming a circuit on a substrate layer for driving and sensing said measuring device;
- c) forming an interface on a substrate layer for inputting power and drive signals and outputting measuring device signals;
- d) forming a housing on a substrate layer for said measuring device and said circuit;
- e) pressing and low temperature co-firing said substrate layers to form components of a sensor package;
- f) aligning and stacking together said substrate layers;
- and
- g) affixing together said aligned and stacked together substrate layers to form said sensor package.
5 more elements
Dependencies are inferred from the claim text.