Method for mounting and testing integrated circuits on printed circuit boards
AssigneeMicron Technology, Inc.
InventorDonald D. Baldwin
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.
Claims10
A method of mounting an integrated circuit device onto a printed circuit board, the method comprising the following steps:
- providing a printed circuit board having a plurality of layers of insulative material including an upper surface on one of the layers, and having bonding sites on the upper surface;
- providing a layer of magnetic material in the interspersed it board interspersed between two of the layers;
- providing an integrated circuit device having a plurality of conductive bonding portions;
- and providing magnetic material in all of the conductive bonding portions of the integrated circuit device;
- moving the integrated circuit device to the printed circuit board;
- magnetically charging the printed circuit board layer to attract the magnetic material in the integrated circuit device and to hold the integrated circuit device onto the printed circuit board;
- testing the printed circuit board and the integrated circuit device while the integrated circuit device is being magnetically held onto the printed circuit board;
- and
- after the testing, soldering the conductive bonding portions of the integrated circuit device to the corresponding bonding sites of the printed circuit board.
A method for mounting an integrated circuit device onto a printed circuit board, the integrated circuit device having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the integrated circuit device is mounted to the printed circuit board, the method comprising the following steps:
- providing a laminated printed circuit board having multiple layers of insulative material and having a plurality of bonding sites;
- providing a layer of magnetizable material between layers in the printed circuit board;
- providing magnetic material within the conductive bonding portions of the integrated circuit device;
- moving the integrated circuit device to the printed circuit board;
- aligning the conductive portions of the integrated circuit device with the corresponding bonding sites of the printed circuit board;
- placing the conductive portions in contact with the corresponding bonding sites;
- magnetizing the layer of magnetizable material in the printed circuit board to create a magnetic field and to hold the integrated circuit device onto the printed circuit board;
- testing the integrated circuit device and the printed circuit board while the integrated circuit device is held onto the printed circuit board by the magnetic field;
- and
- soldering the conductive bonding portions to the corresponding bonding sites of the printed circuit board while the integrated circuit device is held onto the printed circuit board by the magnetic field.
Dependencies are inferred from the claim text.