Liquid crystal panel and manufacturing method the same with a thickness of the adhesive layer adjusted to eliminate a step difference

A liquid crystal panel comprising:

• a single multi-panel composed of a plurality of divided liquid crystal panels connected to one another on sides, said plurality of divided liquid crystal panels being a pair of electrode substrates sandwiching a liquid crystal layer;
• and
• a supporting substrate combined with said single multi-panel,
• the plurality of divided liquid crystal panels being combined with said supporting substrate via an adhesive layer,
• the adhesive layer being formed on a connected portion and an entire surface of the plurality of divided liquid crystal panels,
• the plurality of divided liquid crystal panels being covered with a coating layer having flexibility via the adhesive layer,
• the adhesive layer and the coating layer leveling a surface of said single multi-panel,
• a thickness of the adhesive layer being adjusted so as to eliminate a step-difference due to thickness non-uniformity of substrates constituting the plurality of divided liquid crystal panels, and a surface of the single multi-panel being leveled by the adhesive layer and the coating layer.

A method for manufacturing a liquid crystal panel, comprising the steps of:

• forming a pair of electrode substrates facing each other by combining with each other via a sealant (A) an electrode substrate composed of a plurality of small substrates connected to one another on sides and (B) a single unit electrode substrate;
• enclosing a liquid crystal layer in a spacing between the pair of electrode substrates;
• and
• applying an adhesive on a connected portion and an entire surface of the plurality of small substrates, and attaching a coating layer having flexibility levelly so as to cover the plurality of small substrates by adjusting a thickness of the adhesive on the surface of the plurality of small substrates so that a step-difference due to thickness non-uniformity of the plurality of small substrates is eliminated, and thereafter curing the adhesive.