Back to results
US 6,144,215 AGranted
Setup for testing an integrated circuit in a semiconductor chip wherein the temperature of the semiconductor chip is controlled
AssigneeIntel Corporation
InventorsMartin M. Maxwell, Dan Weinstein
Life of this patent
Estimating the term…
Abstract
A test setup for testing an integrated circuit. A holder is provided which is capable of releasably receiving and holding the integrated circuit. Apparatus is provided which tests the integrity of the integrated circuit. A controller is provided which controls the temperature of the integrated circuit.
Claims14
A test setup for testing an integrated circuit, comprising:
- a holder capable of releasably receiving and holding an integrated circuit;
- apparatus for testing the integrity of the integrated circuit;
- a heat sink located on the holder, the heat sink having a surface positioned to absorb heat buildup on the integrated circuit;
- a heater located within the heat sink;
- a flow control unit for blowing a fluid over the heat sink;
- a temperature detector positioned to measure a variable which is indicative of a temperature of the integrated circuit;
- and
- a controller which reacts to the variable to (i) alter power supplied to the heater so that the heater heats the heat sink and the heat sink heats the integrated circuit, or (ii) so that the flow control unit blows a fluid over the heat sink so that the heat sink is cooled, cooling of the heat sink causing cooling of the integrated circuit.
5 more elements
The test setup of claim wherein the 10 flow control unit operates in either
- a first mode wherein power is supplied to the heat sink, or
- a second mode wherein flow is supplied by the flow control unit to the pipe.
A method of testing an integrated circuit, the method:
- connecting the integrated circuit to an electrical tester;
- utilizing the electrical tester to test the integrity of the integrated circuit;
- measuring a variable which is indicative of the temperature of a chip;
- and
- reacting on the variable to alter a temperature of the chip by:
- (i) blowing a fluid onto a heat sink thereby transferring heat from the integrated circuit to the heat sink and connecting the heat from the heat sink or
- (ii) supplying power to a heater located within the heat sink to heat the heat sink which, in turn, heats the integrated circuit.
4 more elements
A test setup for testing an integrated circuit, comprising:
- a holder capable of releasably receiving and holding an integrated circuit;
- apparatus for testing the integrity of the integrated circuit;
- a heat sink located on the holder, the heat sink having a surface positioned to absorb heat buildup on the integrated circuit, and a plurality of fins for connecting heat away therefrom;
- a heater located within the heat sink;
- a temperature detector positioned to measure a variable which is indicative of a temperature of the integrated circuit;
- and
- a controller which reacts to the variable to alter power supplied to the heater.
4 more elements
Dependencies are inferred from the claim text.