High-operating-temperature electronic component
AssigneeVisteon Corporation
InventorsJay DeAvis Baker, Mohan R. Paruchuri, Prathap Amerwai Reddy, Vivek Amir Jairazbhoy
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Abstract
A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.
Claims15
A semiconductor die package for operation at first temperature not to exceed a maximum operating temperature, the package comprising:
- a semiconductor die;
- a package substrate;
- a quantity of a first thermally conductive die attach material extending between the die and the substrate, the first material softening or at least partially liquefying at the first temperature, the first material forming a thermal couple between the die and the substrate;
- and
- a quantity of a second die attach material extending between the die and the substrate, the second material forming a relatively compliant mechanical couple between the die and the substrate up to a second temperature greater than the maximum operating temperature.
An article for attaching an electronic component to a substrate for use at a first temperature not to exceed a maximum operating temperature, the article comprising:
- a generally flat preform formed of a quantity of a first thermally conductive die attach material and defining a lateral periphery having a nominal thickness, the first material softening or at least partially liquefying at a first temperature less than the maximum operating temperature;
- and
- a quantity of a second die attach material in touching contact with at least a portion of the periphery of the preform, in an amount sufficient to contain the applied solder material and otherwise bridge the gap between the component and the substrate upon subsequent liquefaction and collapse of the applied solder material along its thickness dimension.
Dependencies are inferred from the claim text.