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US 6,144,101 AGranted
Flip chip down-bond: method and apparatus
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
Estimating the term…
Abstract
A flip-chip semiconductor device comprises a carrier substrate having a conductor pattern on at least one side, and at least one semiconductor die with an active surface and an opposed ground surface. A conductive backing plate is conductively bonded to the ground surface. The active surface faces and is electrically connected to the conductor pattern of the carrier substrate. A conductive down-bond connection is provided between the backing plate and a ground connection or reference potential connection. The backing plate is preferably rigid and can be manipulated for indirect alignment of the die or dice carried thereon relative to the substrate.
Claims34
A semiconductor device, comprising:
- a carrier substrate having a pattern of conductors on at least a first surface;
- at least one semiconductor die having an active surface on a first side and a second surface on an opposed second side, said active surface comprising an integrated circuit and configured to face said carrier substrate first surface for electrical connection to conductors of said pattern, said second surface of said at least one semiconductor die being adapted to receive a voltage level applied to said semiconductor die;
- a substantially rigid, electrically conductive backing plate immovably affixed and conductively bonded to the second surface of said at least one semiconductor die, wherein said substantially rigid, electrically conductive backing plate covers all of said second surface of said semiconductor die and extends laterally beyond a periphery of said semiconductor die, said substantially rigid, electrically conductive backing plate having sufficient rigidity to maintain said at least one semiconductor die immovably affixed thereto in alignment with said carrier substrate so that said integrated circuit is in electrical connection with said conductors of said pattern;
- and
- a conduction element electrically connecting said substantially rigid, electrically conductive backing plate to a conductor of said carrier substrate to effect said voltage level application.
2 more elements
A flip-chip semiconductor device component, comprising:
- at least one integrated circuit chip having an active first surface and a second opposed surface, said active first surface configured to electrically connect said at least one integrated circuit chip to conductors of a carrier substrate;
- and
- a substantially rigid, electrically conductive backing plate immovably affixed and conductively bonded to said second surface of said at least one integrated circuit chip, wherein said substantially rigid, electrically conductive backing plate covers said second surface and extends laterally beyond a periphery of said at least one integrated circuit chip, said substantially rigid, electrically conductive backing plate having sufficient rigidity to maintain a substantially precise location thereon of said at least one integrated circuit chip for positioning of said at least one integrated circuit chip by manipulation of said substantially rigid, electrically conductive backing plate whereby said at least one integrated circuit chip may be substantially precisely aligned with a carrier substrate for affixation thereto.
A flip-chip semiconductor device, comprising:
- a carrier substrate having a pattern of conductors for attachment thereto of multiple flip-chip semiconductor dice, said pattern of conductors including a conductor for providing a common potential to said flip-chip semiconductor dice;
- an electrically conductive backing plate sized and configured to be generally coextensive with a plurality of flip-chip dice attached to said pattern of conductors on said carrier substrate;
- a plurality of flip-chip semiconductor dice, each of said plurality of flip-chip semiconductor dice having an active surface facing and conductively joined to said carrier substrate pattern of conductors, and an opposing surface conductively joined to said electrically conductive backing plate, wherein said electrically conductive backing plate covers each opposing surface and extends laterally beyond a periphery of each of said plurality of flip-chip semiconductor dice;
- and
- a conductive down-bond connector electrically connecting said electrically conductive backing plate to said common potential conductor on said carrier substrate.
2 more elements
Dependencies are inferred from the claim text.