Semiconductor device
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorTetsuro Washida
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Abstract
A semiconductor device comprising a plurality of bump electrodes wherein signal pins requiring electrical connection are assigned in sequence from the bump electrodes at the outermost periphery near the edge of the semiconductor device to the bump electrodes in an interior area of the semiconductor device, and no-connection pins requiring no electrical connection are assigned to the remaining bump electrodes, is provided. Circuit board cost is thus reduced, and the ease of mounting the semiconductor device to the circuit board is improved.
Claims7
A semiconductor device for connection to a circuit board comprising:
- a plurality of bump electrodes arranged in a first area and a second area, said second area extending around the periphery of said first area, wherein
- a signal pin for electrical connection to the circuit board is assigned to at least one of said plurality of bump electrodes located in said second area, and wherein
- a non-electrical connection pin configured for mechanical connection to the circuit board is assigned to at least one of said plurality of bump electrodes located in said first area.
A device comprising:
- a semiconductor device mounted on a circuit board and including a plurality of bump electrodes arranged in a first area and a second area, said second area extending around the periphery of said first area;
- a said circuit board including a signal pin and a non-electrical connection pin, said signal pin being assigned to at least one of said plurality of bump electrodes located in said second area, and a non-electrical connection pin being assigned and mechanically connected to at least one of said plurality of bump electrodes located in said first area;
- and
- a line to each of said bump electrodes to which said signal pin of the semiconductor device is assigned.
Dependencies are inferred from the claim text.