Inner-digitized bond fingers on bus bars of semiconductor device package

A semiconductor device package comprising:

• a lead frame including a plurality of lead members;
• a semiconductor die secured to the lead frame;
• at least one pair of bus bars connected to the lead frame and positioned over the semiconductor die, portions of the bus bars of the at least one pair positioned over the semiconductor die including a plurality of inner-digitized bond fingers;
• another pair of bus bars without inner-digitized bond fingers that extends across the semiconductor die;
• a first plurality of connection members electrically coupling the lead members to the semiconductor die;
• and
• a second plurality of connection members electrically coupling the inner-digitized bond fingers of the bus bars to the semiconductor die.

A semiconductor device package, comprising:

• a lead frame including a plurality of lead fingers positioned on a first plane;
• a semiconductor die secured to the lead frame, the semiconductor die including a first plurality of bond pads and a second plurality of bond pads disposed thereon;
• at least one pair of bus bars operatively connected to the lead frame and positioned over the semiconductor die so as to be offset from the first plane to a second plane, a portion of the bus bars positioned over the semiconductor die including a plurality of inner-digitized bond fingers;
• a first plurality of bond wires electrically coupling the lead fingers to the first plurality of bond pads on the semiconductor die;
• a second plurality of bond wires electrically coupling the inner-digitized bond fingers of the bus bars to the second plurality of bond pads on the semiconductor die, wherein the second plurality of bond wires has a substantially uniform loop height and length;
• and
• an encapsulating material formed around the semiconductor die, the bus bars, the first and second pluralities of bond wires, and an inner portion of the lead frame.

A semiconductor device package having a lead-over-chip structure, comprising:

• a lead frame including a plurality of lead fingers;
• a semiconductor die secured to the lead frame, the semiconductor die including a first plurality of bond pads and a second plurality of bond pads thereon;
• a first bus bar operatively connected to the lead frame and traversing over the semiconductor die, the first bus bar including a plurality of alternating projections and recesses;
• a second bus bar operatively connected to the lead frame and traversing over the semiconductor die adjacent to the first bus bar, the second bus bar including a plurality of alternating projections and recesses, wherein each of the projections of the second bus bar extends into a corresponding one of the recesses of the first bus bar and each of the projections of the first bus bar extends into a corresponding one of the recesses of the second bus bar;
• a first plurality of bond wires electrically coupling the first bus bar to the semiconductor die, each of the first plurality of bond wires being connected to one of the projections of the first bus bar and one of the first plurality of bond pads on the semiconductor die;
• and
• a second plurality of bond wires electrically coupling the second bus bar to the semiconductor die, each of the second plurality of bond wires traversing the first bus bar to be connected to one of the projections of the second bus bar and one of the second plurality of bond pads on the semiconductor die.

A lead frame for use in a semiconductor device package, comprising:

• a plurality of lead members positioned on a first plane;
• at least one pair of bus bars adjacent to the lead members, the bus bars configured to be positioned over a semiconductor die and including a plurality of inner-digitized bond fingers;
• and
• another pair of bus bars without inner-digitized bond fingers that is configured to extend across the semiconductor die.

A lead frame for use in a semiconductor device package having a lead-over-chip structure, comprising:

• a plurality of lead fingers positioned in an array on a first plane along a vertical axis extending from a surface of a semiconductor die;
• a first bus bar adjacent to the lead fingers, the first bus bar configured to traverse over the semiconductor die and including a plurality of alternating projections and recesses, the first bus bar configured to be offset from the first plane along the vertical axis;
• and
• a second bus bar adjacent to the first bus bar, the second bus bar including a plurality of alternating projections and recesses, wherein each of the projections of the second bus bar extends into a corresponding one of the recesses of the first bus bar and each of the projections of the first bus bar extends into a corresponding one of the recesses of the second bus bar, the second bus bar configured to be offset from the first plane along the vertical axis.